轻触开关, 按键开关,滑动开关,拨动开关,检测开关,等开关产品的注意事项与使用条件。 4. Precaution注意事项 4.1 Soldering condition 浸焊条件 ITEM项目 CONDITION条件 Preheat temperature 预热温度 110ºC max (Embilomental temperature of soldering surface of P. W. E) 110ºC 以下(印刷基板焊锡面周围的温度) Preheat time 预热时间 60 sec, max 60 秒以内 Area of flux 助焊剂的面积 1/2 max of P. W. B. thickness 印刷基板厚度的1/2 以内 Temperature of solder 焊锡温度 255ºC max 255ºC 以下 Time of immersion 浸焊时间 Within 5 sec 5 秒以内 Soldering number 浸焊次数 Within 2 times (But should bring down heat of the first soldering) 2 次以内 (但应把第一次焊锡的温度降下来) Printed wiring board 印刷基板 Single sided copper-clad laminates 单面铜箔(1) After switches were soldered, please be careful not to clean switches with solvent 开关浸焊后,注意不要用溶剂清洗. (2) In the case of using soldering iron, soldering conditions shall be 280ºC max and 3 sec. max 在使用铬铁的情况下,焊锡温度应在300ºC 以下、3 秒以内. (3) Right after switches were soldered; please be careful not to load on the knobs of switches. 浸焊后,注意不要在顶部施加负荷. 4. 2 Design instructions(设计中应注意的事项) (1) Follow recommended P. W. B. piercing plan in outside drawing page. 印刷基板的安装孔尺寸参见产品图. (2) Design key top as fig. Design inclination of key top 4 deg. max as fig. (Recommended operating condition.) 击键部设计如图,击键部倾斜度如图在4 度以内. (参见操作条件). 4.3 Note(注意点) (1) Please be cautious not to give excessive static load or shock to switches. 注意不要施加超负荷的压力或晃动开关. (2) Please be careful not to pile up P. W. B. after switches were soldered. 开关焊接以后,印刷基板注意不要叠放. (3) Preservation under high temperature and high humidity or corrosive gas should be avoided especially. When you need to preserve for a long period, do not open the carton. 保管时尤其应注意避开高湿高温和有腐蚀性气体的环境.如需长时间保存,请不要打开包装箱. (4) Panasert RH and RH6 shall be used as the standard insert machine (use N type clinch). 使用标准插入机器PANASERT 和RH6（使用N 式钉） (5) Preservation under high temperature and high humidity or corrosive gas should be avoided especially, when you need to preserve for a long period, do not open the carton. 特别注意避免将产品保存在高温、强温度或有腐蚀性气体的地方。若长期保存，请勿打开包装箱。